<p>An etching apparatus is provided to obtain the uniform etching rate by preventing a micro bubble in a wet etching process. An etching apparatus includes an etch chamber(10), a piping unit(14), a mask substrate(13) and a transfer unit(11). The piping unit is positioned in an upper part inside the etch chamber. The piping unit includes a plurality of nozzle(15) for spraying the etchant. The mask substrate is positioned in the bottom of the piping unit. The transfer unit is positioned in the bottom of the mask substrate and transfers the substrate. The mask substrate is positioned between the piping unit and the substrate. The mask substrate has a mesh type and a plurality of holes or a slit type.</p>
