| 摘要 |
PROBLEM TO BE SOLVED: To provide a transparent electromagnetic wave shield film which is easily manufactured by a simple operation, being excellent in adhesion between a base material and the metal layer formed on the base material and patterned, with no peeling and cracking of the metal layer even at bending or flexing. SOLUTION: A plating film comprises a transparent base material film, a coating layer formed in such pattern as contains conductive polymer fine particles and a binder on the surface of the base material, and a metal plating film formed on the coating layer by electroless plating method. A: The binder is 0.1-10 pts.mass against 1 pts.mass of conductive polymer fine particles. B: The thickness of the coating layer is 20-500 nm. C: The thickness of the metal plating film is 100-3,000 nm. COPYRIGHT: (C)2009,JPO&INPIT
|
