| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable semiconductor device capable of obtaining the predetermined electrical characteristic in the semiconductor packaged under a satisfactory junction. SOLUTION: A substrate 2 and the semiconductor 1 are press-contacted and electrically jointed through a substrate electrode 2A and a semiconductor electrode 3, and the semiconductor device is manufactured by adhering and sealing between the substrate 2 and the semiconductor 1 by an adhesive-sealing material 4. At least one assembly of the substrate electrode 2A and the semiconductor electrode 3 are jointed while one or the both of the substrate electrode 2A and the semiconductor electrode 3 have a press-contacting surface 2A-1 slanted orthogonally to the direction of the press-contact. COPYRIGHT: (C)2009,JPO&INPIT |
