| 摘要 |
A method of making smart cards with an encapsulant (23) without having a bulge by heat lamination is disclosed. The core material (21) is cut for the encapsulant (23), such as a sensor or electronic component and laminated with a bottom layer (24) to create a cavity (22). The encapsulant (23) is introduced in the cavity (22) and laminated with another layer (27).
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