发明名称 HIGH-IMPEDANCE SUBSTRATE
摘要 A high-impedance substrate is provided, which includes a metallic plate employed as a ground plane, a resonance circuit layer spaced away from the metallic plate by a distance "t", the resonance circuit layer being provided with at least two resonance circuits having the same height and disposed side by side with a distance "g", a connecting component connecting the resonance circuit with the metallic plate, and a magnetic material layer interposed between the metallic plate and the resonance circuit layer. The distance "t" between the metallic plate and the resonance circuit layer is confined within the range of 0.1 to 10 mm, the distance "g" between neighboring resonance circuits is confined within the range of 0.01 to 5 mm, the distance "h" between the magnetic material layer and the resonance circuit layer is confined within the range represented by the following inequality 1: <?in-line-formulae description="In-line Formulae" end="lead"?>g/2<=h<=t/2 inequality 1.<?in-line-formulae description="In-line Formulae" end="tail"?>
申请公布号 US2009021444(A1) 申请公布日期 2009.01.22
申请号 US20080175854 申请日期 2008.07.18
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 AIGA FUMIHIKO;SUENAGA SEIICHI;HARADA KOUICHI;SUETSUNA TOMOHIRO;YONETSU MAKI;NAKAGAWA NAOYUKI;EGUCHI TOMOKO
分类号 H01Q1/00 主分类号 H01Q1/00
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