发明名称 Functional-Element-Mounted Module, Process for Producing the Same, Resin Sealing Plate for Use Therein, and Substrate Structure for Resin Sealing
摘要 Opposed to a substrate (2) having a functional element (1) with a functional portion (1a) mounted thereon, there is disposed a resin sealing plate (3) provided with an opening (3a) corresponding to the functional portion (1a) of the functional element (1) with a given spacing therebetween. Impregnation and filling of a sealing resin (5) in the spacing between the substrate (2) and the resin sealing plate (3) are carried out by the use of the capillary phenomenon. Thus, resin sealing of the functional element (1) can be realized without damaging to the function of the functional portion (1a).
申请公布号 US2009022949(A1) 申请公布日期 2009.01.22
申请号 US20060086152 申请日期 2006.11.28
申请人 SONY CHEMICAL & INFORMATION DEVICE CORPORATION 发明人 HORITA YOSHIHITO;KANISAWA SHIYUKI;ASADA TAKAHIRO;YONEDA YOSHIHIRO
分类号 B32B3/10;B05D5/06;B31B1/60;C08F2/48 主分类号 B32B3/10
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