EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICONDUCTOR DEVICE

摘要

Disclosed is an epoxy resin composition for semiconductor encapsulation, which contains a phenol resin represented by the formula (1) below, an epoxy resin represented by the formula (2) below and an inorganic filler. (1) (In the formula (1), a plurality of R's independently represent a hydrogen atom or an alkyl group having 1-4 carbon atoms; and n represents an average value satisfying the following relation: 1 < n = 4.) (2) (In the formula (2), n represents an average value satisfying the following relation: 1 < n = 3.) The softening point (A) (°C) of the phenol resin represented by the formula (1) and the softening point (B) (°C) of the epoxy resin represented by the formula (2) satisfy the following relation (I): 80 = A + B = 150. This epoxy resin composition for semiconductor encapsulation enables to obtain a cured product which is excellent in flame retardancy and moisture resistance.