| 摘要 |
<P>PROBLEM TO BE SOLVED: To simplify fitting operation for a shield cover for reducing disturbance of radiation noise from a semiconductor configuration 2 to a semiconductor configuration 51 and a chip component 71, in a semiconductor device that has the semiconductor configuration 2 arranged below a base plate 1 and constituting a digital circuit portion, and that has the followings arranged on the base plate 1: the semiconductor configuration 51 constituting an analog circuit portion; and the chip component 71. <P>SOLUTION: Above the base plate 1 having a plurality of semiconductor device formation regions, a shield cover formation body 82 is disposed which has a plurality of shield cover portions 82a and a connection portion 82b connecting them. The connection portion 82b etc., of the shield cover formation body 82 is cut along a cutting line 81 to obtain a plurality of semiconductor devices with shield covers. <P>COPYRIGHT: (C)2009,JPO&INPIT |
