| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition, having high sensitivity and excellent resolution/adhesion, a photosensitive element that uses the same, a method for producing a resist pattern and a method for producing a printed wiring board. <P>SOLUTION: The photosensitive resin composition comprises (A) a binder polymer, (B) a photopolymerizable monomer having an ethylenically unsaturated group, (C) a sensitizer represented by general formula (1), and (D) a photopolymerization initiator comprising a hexaarylbisimidazole, wherein R<SP>1</SP>and R<SP>2</SP>each denote a 1-20C alkyl group, or the like. <P>COPYRIGHT: (C)2009,JPO&INPIT |
