| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To eliminate unnecessary current conduction impedance in prior art and to efficiently and stably reduce the temperature coefficient of resistance (TCR). <P>SOLUTION: A thermo-conductive bonding layer is applied to bond a substrate with a fixed resistor in face-to-face orientation, and a passivation layer is applied to partially cover the fixed resistor, such that it divides the surface not covered with the passivation layer in the fixed resistor into two electrode zones. The bonding design of the substrate and the fixed resistor overcomes the drawback of high cost which arises in the prior art owing to the use of the semiconductor manufacturing process and provides a simple fabrication process capable of increasing process yield and decreasing production cost. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
