DEVICE FOR POLISHING SEMICONDUCTOR WAFER END FACE AND POLISHING HEAD USED FOR THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a polishing technique for efficiently polishing the end face of a semiconductor wafer in a short time while allowing easy device maintenance. SOLUTION: A polishing head 16 is provided for polishing the end face of the semiconductor wafer 12. The head includes a driven roller 42 to be rotationally driven by a motor 32 mounted on the polishing head 16, and first and second free rollers 43a, 43b between which a polishing endless belt 31 is mounted together with the driven roller 42. The polishing endless belt 31 between the first free roller 43a and the second free roller 43b is turned to the outside of the polishing head 16 and made to travel in the horizontal direction to polish the end face of the semiconductor wafer 123 in a horizontal condition. COPYRIGHT: (C)2009,JPO&INPIT