| 摘要 |
A positive photosensitive resin composition exhibiting excellent heat resistance is provided, which comprises an alkali-soluble resin component (A) and a photosensitizer (B), the component (A) including a resin component (A1) having a structural unit (a1) represented by general formula (a1) shown below: wherein R0 represents a hydrogen atom or a methyl group; R1 represents a single bond or an alkylene group of 1 to 5 carbon atoms; R2 represents an alkyl group of 1 to 5 carbon atoms; and a represents an integer of 1 to 5, and b represents 0 or an integer of 1 to 4, with the proviso that the sum of a and b is 5 or less, and when two or more R2 are present, R2 may be the same or different.
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