| 摘要 |
In manufacturing a camera module structure (100), a hot air nozzle (4) melts solder at a solder connection portion (3) by blowing hot air to the solder connection portion (3), while a suction nozzle (5) suctions the hot air that moves toward the camera module (2), from a position nearer from the camera module (2) than a position of the hot air nozzle (4). This makes it possible to manufacture a solder mounting structure in which a heat-vulnerable electronic component can be mounted on a wiring board without being damaged by heat.
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