SEMICONDUCTOR CHIP PACKAGE WITH BENT OUTER LEADS

摘要

A semiconductor chip package (30) comprising a semiconductor chip (31), a lead frame comprising at least one lead (32) and an encapsulating layer (34) at least partially encapsulating the semiconductor chip (31) and the lead frame. The lead (32) comprises a first portion (36) defining a lead frame pad at least partially exposed at an exterior surface of the package and a second portion extending from the first portion (36) towards the semiconductor chip (31) electrically connecting a surface portion of the semiconductor chip (31) to the lead frame pad. The first portion (36) has a first thickness and the second portion comprises a thinned portion (37), the thinned portion (37) having a thickness smaller than the first thickness. The lead (32) further comprises a bent portion, and wherein the thinned portion comprises at least part of the bent portion.