FILM STRUCTURE FOR CUTTING A WAFER, METHOD OF CUTTING A WAFER, AND METHOD OF MANUFACTURING A SEMICONDUCTOR MODULE

摘要

A film structure for cutting a wafer, a wafer cutting method using the same, and a method for manufacturing a semiconductor module are provided to improve reliability of electrical connection between a semiconductor chip and a printed circuit board by integrating the semiconductor chip with the printed circuit board by using an adhesive film. Pads(210) are formed on a first side of a wafer(200). A release film(120) is adhered on the first side of the wafer. A base film(110) is adhered on a second side of the wafer. An adhesive film(130) is adhered on the release film. A cover film(140) is adhered on the adhesive film. The adhesive film includes thermosetting resin to be cut by an ultraviolet ray.