发明名称 ELECTRODE PASTE, COMPACT ELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING THEREOF
摘要 <p><P>PROBLEM TO BE SOLVED: To provide electrode paste, a compact electronic component, and a method for manufacturing thereof which suppresses the generation of burrs and chippings caused by substrate dividing, and can form the compact electronic component having high dimensional accuracy. <P>SOLUTION: In an electrode 13 connected to an external circuit, as a conductive material, Ag, Ag-Pd, Ag-Pt, or Au is contained, further as a frit component, a mixed material composed of MgO, Al<SB>2</SB>O<SB>3</SB>, SiO<SB>2</SB>, CaCO<SB>3</SB>, TiO<SB>2</SB>, CuO and ZnO is contained. The compounding ratio of the frit component is MgO: 0.5-0.8 wt.%, Al<SB>2</SB>O<SB>3</SB>: 5-10 wt.%, SiO<SB>2</SB>: 15-18 wt.%, CaCO<SB>3</SB>: 25-30 wt.%, TiO<SB>2</SB>: 5-8 wt.%, CuO: 10-15 wt.%, and ZnO: 22-25 wt.%. The frit is contained in a proportion of 20-40 wt.% to the whole of the electrode paste. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2009016491(A) 申请公布日期 2009.01.22
申请号 JP20070175233 申请日期 2007.07.03
申请人 TATEYAMA KAGAKU KOGYO KK 发明人 UEDA YOJI;NAKAE YUJI
分类号 H01C17/06 主分类号 H01C17/06
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