| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device which can protect a semiconductor chip from a mechanical shock and has improved reliability at low manufacturing cost. <P>SOLUTION: The semiconductor device is provided with: a semiconductor element 10 having a principle plane 10a where element electrodes 11 are arranged and a side surface 10b; an insulating layer 20 formed on the principal plane 10a and the side surface 10b; a wiring layer 33 formed on the insulating layer 20 located on the principle plane 10a and the side surface 10b and electrically connected to the element electrodes 11; an insulating resin layer 22 formed on a backside 10c of the semiconductor element 10; a metallic wiring layer 34 formed on the insulating resin layer 22 and electrically connected to the wiring layer 33; and an external electrode 32 formed as part of the metallic wiring layer 34 on the insulating resin layer 22. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
