| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring circuit substrate for reducing the transmission loss of wiring without increasing the thickness of the wiring circuit substrate using a simple structure. <P>SOLUTION: A suspension substrate with a circuit 1 comprises a metal support substrate 2 having a concave portion 5, a conductive portion 6 embedded in the concave portion 5 and formed of a material whose conductivity is higher than that of the metal support substrate 2, a base insulating layer 7 formed on the metal support substrate 2 to cover the conductive portion 6, and a plurality of pieces of wiring 4 having intervals so as to oppose the conductive portion 6. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
