| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition having a curing accelerator exhibiting uniform solubility and excellent in preservability at normal temperature, and an electronic component obtained using the same as a sealing agent. SOLUTION: The epoxy resin composition contains the following (A) to (C) components and the electronic component is formed by sealing an electronic device using the epoxy resin composition, wherein (A) is an epoxy resin; (B) is a curing agent; (C) is a specific curing accelerator having boron, phosphorus, a plurality of halogens and 4 phenyl groups. COPYRIGHT: (C)2009,JPO&INPIT
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