| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminate, suitable to microwiring, which can be suitably used for the manufacture of various kinds of printed wiring boards, allowing a metallic layer to be formed fixedly even on the surface, of the laminate, whose surface roughness is inconspicuous, and revealing excellent microwiring moldability, and especially, can be suitably used for printed wiring requiring a microwiring pattern. SOLUTION: The laminate features the following characteristics: at least, one surface of a composite (a) of a fiber and a resin, has a resin layer (b) for forming a metal-plated layer, and the resin layer (b) contains (A) a resin composition component and (B) a filler component as essential components. In addition, the surface roughness of the resin layer (b) is not more than 0.4 um in terms of arithmetic mean roughness Ra as measured at a cut-off value of 0.002 mm. Besides, the specific surface area of the filler (B) is in 20-600 m<SP>2</SP>/g, and the elastic modulus of the resin layer (b) at 20°C, is 2.3-15 GPa. COPYRIGHT: (C)2009,JPO&INPIT
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