发明名称 METAL MASK DEALING WITH ADHESIVE CONVEYING JIG AND SOLDER PRINTING METHOD OF SUBSTRATE BY EMPLOYING IT
摘要 PROBLEM TO BE SOLVED: To provide a metal mask dealing with an adhesive conveying jig, in which the adhesion of a portion bulged out of the substrate contact face side external shape of a substrate in the metal mask to the adhesive part of the adhesive conveying jig is reduced at the creamy solder printing of the substrate, a plate separation is performed smoothly and the reduction of a cycle time can be contrived. SOLUTION: This metal mask 3 dealing with the adhesive conveying jig 8 is employed by fixing the substrate by making the substrate 7 adhesive with an electronic circuit formed thereon to the adhesive part of the adhesive conveying jig and by performing the creamy solder printing of the substrate by bringing the substrate contact face side of the metal mask into contact onto the substrate, by alternately providing a large number of recessed groove parts 31 extending diagonally parallel and a large number of projected stripe parts 32 extending diagonally parallel in a region nearly equal to the adhesive part contacting region of the adhesive conveying jig at the substrate contacting face side of the metal mask dealing with the adhesive conveying jig, the contacting area of the metal mask with the adhesive part during squeegeeing becomes smaller owing to the existence of the recessed groove parts 31. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009012230(A) 申请公布日期 2009.01.22
申请号 JP20070174524 申请日期 2007.07.02
申请人 BONMAAKU:KK 发明人 KATSUYAMA EIICHI
分类号 B41N1/24;B41F15/08;B41F15/36;B41M1/12;H05K3/34 主分类号 B41N1/24
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