| 摘要 |
A method of manufacturing a chip on film (COF) is provided, including: providing a flexible circuit board; and forming a plurality of leads on the flexible circuit board. Each of the leads has a thickness of 8 um~15 um and a cross-section shape is substantially rectangular. A COF structure, having a flexible circuit board and a plurality of leads formed on the flexible circuit board, is provided. Each lead has a thickness of 8 um~15 um, and lead widths of the leads are based on pitch widths of a plurality of bumps corresponding to the leads. A COF structure, having a flexible circuit board and a plurality of leads formed on the flexible circuit board. Each of the leads has a thickness of 8 um~15 um, and a lead width of each of the leads is greater than a bump width minus 4 um.
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