METHOD OF POLISHING SEMICONDUCTOR WAFER AND APPARATUS FOR THE SAME

摘要

A method for polishing semiconductor wafer and polishing apparatus using the same are provided to shorten polishing time by optimizing processing condition. A method for polishing semiconductor wafer comprises the following steps: a step for first-polishing both sides of a wafer after loading a stock pad as a polishing pad(S200); a step for performing a cleaning process by supplying ultrapure water and surfactant between both sides and the stock pad(S210); and a step for second-polishing a cross section of the wafer(S220). The first polishing is performed by supplying stock slurry from a stock slurry supply tank. The second polishing is performed by supplying final slurry from a final slurry supply tank after stopping supply of the stock slurry.