| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface mounting component mounter, which can mount a bare chip component on a substrate, and to provide the electronic component suction nozzle of the surface mounting component mounter. SOLUTION: A surface mounting component mounter is constituted in a structure that when a bare chip component is mounted on a substrate, a control part 18 selects a bare chip component suction nozzle 14 having a pyramidal collet 12, makes the nozzle 14 support by a head shaft 22 to make the bare chip component vacuum-suck to the nozzle 14 and makes the bare chip component transfer to a prescribed mounting position on the substrate. Then an X-Y driving part 26 is driven to control the bare chip component to execute a scrub operation treatment and after that, the bare chip component is released from the state of the vacuum suction to mount the bare chip component on the substrate. |
