PLASTIC SEMICONDUCTOR PACKAGE HAVING IMPROVED CONTROL OF DIMENSIONS

摘要

A device with a semiconductor chip ( 801 ) assembled on a planar substrate ( 802 ) and encapsulation compound ( 810 ) surrounding the assembled chip and a portion of the substrate near the chip; the compound has a planar top area ( 811 ). The encapsulation compound has a plurality of side areas ( 812 ) reaching from the substrate to the top area; these side areas form edge lines with the top area, where the top area plane intersects with the respective plane of each side area. The encapsulation compound is recessed ( 813 ) along the edge lines so that the material is caved-in along the lines; this feature causes the recess to prevent any compound from the side area planes to reach the top area plane, whereby the planarity of the top area is preserved.