| 摘要 |
<p>A semiconductor module (100) comprises a base member (107), a semiconductor die (101), a fastening unit (106) for fastening the semiconductor die (101) to the base member (107) and an insulating foil (201). The semiconductor die includes contacting units (103, 104) for electrical connection of the semiconductor die (101) to external circuit units and a planar edge termination unit (102a - 102n). The planar edge termination unit (102a - 102n) is insulated by the insulating foil (201) which is provided as a polymeric foil, a polyamide foil, a ceramic foil and/or a fibre reinforced sheet.</p> |
