发明名称 |
SEMICONDUCTOR COMPONENTS AND SYSTEMS HAVING ENCAPSULATED THROUGH WIRE INTERCONNECTS (TWI) AND WAFER LEVEL METHODS OF FABRICATION |
摘要 |
A semiconductor module system includes a module substrate and a semiconductor substrate having a through wire interconnect bonded to an electrode on the module substrate. The through wire interconnect includes a via, a wire in the via having a first end bonded to a substrate contact on the semiconductor substrate and a polymer layer at least partially encapsulating the wire. The semiconductor module system can also include a second substrate stacked on the semiconductor substrate having a second through wire interconnect in electrical contact with the through wire interconnect. |
申请公布号 |
EP2016607(A2) |
申请公布日期 |
2009.01.21 |
申请号 |
EP20070749404 |
申请日期 |
2007.01.29 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
HEMBREE, DAVID, R.;WOOD, ALAN, G. |
分类号 |
H01L23/48;H01L21/48;H01L21/768;H01L23/498;H01L25/065;H01L25/10 |
主分类号 |
H01L23/48 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|