| 摘要 |
A semiconductor chip package 30 comprising a semiconductor chip 31, a lead frame comprising at least one lead 32 and an encapsulating layer 34 at least partially encapsulating the semiconductor chip 31 and the lead frame. The lead 32 comprises a first portion 36 defining a lead frame pad at least partially exposed at an exterior surface of the package and a second portion extending from the first portion towards the semiconductor chip 31 electrically connecting a surface portion of the semiconductor chip 31 to the lead frame pad. The first portion 36 has a first thickness and the second portion comprises a thinned portion 37, the thinned portion having a thickness smaller than the first thickness. The lead 32 further comprises a bent portion, and wherein the thinned portion comprises at least part of the bent portion. The package may comprise a plurality of semiconductor chips. Further disclosed is a method of fabricating a chip package. |
