STACKED SEMICONDUCTOR DEVICE AND SIGNAL DISTRIBUTION METHOD

摘要

A stacked semiconductor device and a signal distribution method are provided to distribute a common signal to a plurality of chips by using a ladder type circuit network method in the plurality of stacked chips regardless of the number of chips. A plurality of chips(CP1-CP5) include a plurality of elements and perform a previously set operation by receiving the signal. A first ladder main signal line(MLH1) transmits a clock signal to the plurality of chips commonly. The second ladder main signal line(MLH2) is adjacent to one first ladder main signal line or more and is arranged to penetrate through the plurality of chips(CP1-CP5). A ladder buffer(bf0-bf5) is formed between one or more first ladder main signal lines(CP1- CP5) and one or more second ladder main signal lines on the plurality of chips and buffers the applied signal through the first ladder main signal line and outputs the buffered signal to the second ladder main signal line.