发明名称 INJECTION MOLDING DEVICE AND INJECTION MOLDING METHOD USING THE SAME
摘要 An injection molding device and an injection molding method using the same are provided to performing a printing operation on a molded article in the molding process by injecting molten resin into the molding space in a state that ink is transferred to an inner surface of a molding space. An injection molding device comprises a mold forming a molding space, a printing plate(20) on which a printing shape(21) is formed, an ink supply unit(30) supplying ink to the printing shape, and a transfer unit(40) smeared with the ink supplied to the printing shape to transfer the ink to an inner surface of the molding space of the mold. The printing shape is formed on the printing plate by intaglio.
申请公布号 KR20090008024(A) 申请公布日期 2009.01.21
申请号 KR20070071309 申请日期 2007.07.16
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 IWATA TAKAO;SUNG, HAK KYUNG;LEE, DONG YUL
分类号 B29C45/16;B29C45/14;B29C45/26 主分类号 B29C45/16
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