| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayered circuit board and its manufacturing method where a fine circuit pattern is formed at high precision and peeling is suppressed. SOLUTION: The multilayered circuit board 100 comprises a plurality of resin films of thermo-plastic resin in each of which a circuit pattern 2 is formed by ink jetting and which are pasted together to be an insulating mother material 1, an absorbing layer 3 for absorbing a solvent of ink that is partially formed while comprising a position where a circuit pattern is formed on each resin film, the circuit pattern 2 where the pigment of ink comprising a circuit material whose particle size is a nanometer order is baked and which is formed on the absorbing layer 3, and a connection conductor 7 which is obtained by baking the conductive paste filled in a through hole penetrating the resin film and the absorbing layer 3 and connects the circuit patterns 2 to one another. COPYRIGHT: (C)2004,JPO&NCIPI |
