发明名称 |
System and method for direct-bonding of substrates |
摘要 |
A MEMS package includes a first substrate having a bonding surface and a second substrate having a polished bonding surface facing the bonding surface of the first substrate. The MEMS package further includes a polished layer of bonding substrate material deposited onto the bonding surface of the first substrate and fusion bonded to the polished bonding surface of the second substrate. |
申请公布号 |
GB2427309(B) |
申请公布日期 |
2009.01.21 |
申请号 |
GB20060017733 |
申请日期 |
2005.03.24 |
申请人 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. |
发明人 |
CHIEN-HUA CHEN;CHARLES C HALUZAK |
分类号 |
B81B7/00;B81C1/00 |
主分类号 |
B81B7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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