| 摘要 |
The invention relates to a method for producing an integrated circuit. According to said method, a circuit structure (20) is produced in a defined section (18) of a semiconductor wafer (10). The defined wafer section (18) is then cut out of the semiconductor wafer (18) by first exposing the wafer section (18) until it is held only via local, web-like connections (24) on the remaining semiconductor wafer (10). The web-like connections (24) are then severed. According to an embodiment of the invention, the wafer section (18) is exposed in such a manner that the web-like connections (24) are arranged in a lateral periphery of the wafer section (18). |
