| 摘要 |
A method for manufacturing a surface acoustic wave device includes the steps of forming an IDT electrode, a first wiring pattern, and a third wiring pattern on a piezoelectric substrate, forming an insulating film covering the IDT electrode and the wiring patterns, forming a photosensitive resin film, obtaining the photosensitive resin film, and forming a second wiring pattern on an insulating layer composed of the insulating film and the photosensitive resin film laminated on the insulating film so that the second wiring pattern three-dimensionally crosses the first wiring pattern.
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