Dry adhesives, methods of manufacture thereof and articles comprising the same

摘要

Disclosed herein is a printed circuit board comprising a laminate that comprises a copper foil; inorganic or metallic nanoparticles having an average diameter of less than 100 nanometers disposed on a surface of the copper foil; the nanoparticles being arranged in domains; the domains having average domain sizes of about 10 to about 100 nanometers and average interdomain spacings of 10 to about 1,000 nanometers; the nanoparticles not facilitating the transfer of an electrical current; a layer of solid organic polymer disposed on the nanoparticles; the layer of the organic polymer being bounded to the nanoparticles by van der Waals forces; the laminate being employed in a printed circuit board.