发明名称 |
Glass substrate and glass cutting method |
摘要 |
A glass substrate excellent in strength properties and a glass cutting method are provided. When a glass substrate having predetermined size is to be formed by cutting a glass plate, any crack or chip is not generated on a cut face. Therefore, a pulverized powder is prevented from being generated from this portion. A glass substrate is obtained by cutting at least with laser light radiation so that a surface roughness of cut side faces and of the glass substrate are 50 nm or less and a depth of laser marks and on the cut side faces are 0.06 mm or more.
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申请公布号 |
US7479319(B2) |
申请公布日期 |
2009.01.20 |
申请号 |
US20030621714 |
申请日期 |
2003.07.18 |
申请人 |
SONY CORPORATION |
发明人 |
HIRANO TOMIO;OIKAWA NOBUYUKI;ONODERA MAKIO;ONO MASAO;SATO HIDEKI;ONODERA YUKIHIRO |
分类号 |
B28D1/22;B32B1/00;B23K26/00;B23K26/14;B23K26/40;C03B33/07;C03B33/09 |
主分类号 |
B28D1/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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