发明名称 |
Semiconductor device having transparent member and manufacturing method of the same |
摘要 |
A semiconductor device, includes a semiconductor substrate having a main surface where a light receiving element area is formed; a projection part provided in the periphery of the light receiving element area on the main surface of the semiconductor substrate; an adhesive material layer provided in the external periphery of the projection part on the main surface of the semiconductor substrate; and a transparent plate supported by the projection part and fixed above the light receiving element area by the adhesive material layer. |
申请公布号 |
US7479627(B2) |
申请公布日期 |
2009.01.20 |
申请号 |
US20060408970 |
申请日期 |
2006.04.24 |
申请人 |
FUJITSU MICROELECTRONICS LIMITED |
发明人 |
YOSHIMOTO KAZUHIRO;SHIMOBEPPU YUZO;TESHIROGI KAZUO;SHINJO YOSHIAKI |
分类号 |
H04N5/225 |
主分类号 |
H04N5/225 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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