Bottom heatslug EPBGA for high thermal performance

摘要

A laminate circuit board package having a thermal heat spreader or heatslug thermally coupled to an electrical component such as an integrated circuit (IC) in order to dissipate heat within the IC by forming a heatpath away from the IC. The heat spreader is preferably formed of high performance thermal materials and thermally coupled to the IC. The heat spreader is configured to provide an enhanced thermal passage that efficiently facilitates the flow of heat away from the chip. The thermal heat spreader is coupled to the IC via one or more holes formed in the laminate board to efficiently disperse heat away from the chip and onto an attached motherboard.