Bonding pad structure disposed in semiconductor device and related method

摘要

The present invention discloses a bonding pad structure disposed in a semiconductor device and a method for forming the bonding pad structure. The semiconductor device includes a substrate. The bonding pad structure includes a connection structure and an induction structure. The connection structure allows for a direct connection with a bonding wire. The induction structure is coupled with the connection structure and lowers an effective capacitance between the bonding wire and the substrate.