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发明名称
溅镀标靶、氧化物半导体膜及半导体装置
摘要
本发明之溅镀标靶,其系由含铟(In)及至少一种以上选自钆(Gd)、镝(Dy)、钬(Ho)、铒(Er)及镱(Yb)之元素的氧化物之烧结体所成,其特征为该氧化物之烧结体系实质上由方铁锰矿构造所成。
申请公布号
TW200902740
申请公布日期
2009.01.16
申请号
TW097109627
申请日期
2008.03.19
申请人
出光兴产股份有限公司
发明人
井上一吉;矢野公规;笠见雅司
分类号
C23C14/34(2006.01);C23C14/08(2006.01);H01L29/786(2006.01)
主分类号
C23C14/34(2006.01)
代理机构
代理人
林志刚
主权项
地址
日本
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