发明名称 MANUFACTURING METHOD OF TOUCH PANEL
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a touch panel capable of maintaining strong bonding force even under high humidity and enhancing reliability of electric connection after hardening of a bonding agent. <P>SOLUTION: In the manufacturing method of the touch panel wherein a pair of substrates 11, 12 faced with each other and pasted together are arranged, and wiring conductors 25c, 25d formed on one glass substrate 11 and framed electrodes 23, 23 formed on the other film substrate 12 are electrically connected with each other via a silicone bonding agent, the conductive bonding agent is a silicone bonding agent including silver particles, and the silicone bonding agent wherein the silver particles include larger granular powder or scale-shaped powder with a particle size of 10 to 90 micrometers and smaller granular powder or scale-shaped powder with a particle size of 1 to 20 micrometers at a weight ratio of 50:50 to 2:98 is used. The silicone bonding agent is hardened by being heated within a temperature range of 100 to 130°C, for 30 to 180 minutes, and the wiring conductors 25c, 25d and framed electrodes 23, 23 are respectively connected with each other. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2009009917(A) 申请公布日期 2009.01.15
申请号 JP20070172726 申请日期 2007.06.29
申请人 FUJITSU COMPONENT LTD 发明人 MATSUDA GENICHI
分类号 H01H11/00;C09J7/00;C09J7/02;C09J11/04;C09J183/04;C09J183/05;G06F3/041;H01B1/00;H01B1/22;H01H13/712 主分类号 H01H11/00
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