| 摘要 |
PROBLEM TO BE SOLVED: To provide a miniaturized and high-integration high-frequency circuit component with no degradation in isolation, even if a plurality of low noise amplifiers are loaded closely. SOLUTION: The high-frequency circuit component is formed on a dielectric substrate and is provided with at least two antenna terminals, at least one transmission terminal for a first communication system and at least two reception terminals for the first communication system; a first low noise amplifier is provided in a reception route between a first reception terminal for the first communication system and a first antenna terminal, and a second low-noise amplifier is provided in a reception route between a second reception terminal for the first communication system and a second antenna terminal. The first and second low-noise amplifiers are of rectangular shape in the plan view and are respectively provided with an input terminal on one side and an output terminal on the other side facing the one side; and the first and second low-noise amplifiers are mounted on the dielectric substrate so that one side of each other or the other side of each other faces each other. COPYRIGHT: (C)2009,JPO&INPIT
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