| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a circuit device for cleaning and roughening a surface of conductive foil by irradiation with plasma, and a manufacturing method of a circuit device that solves a problem that a semiconductor element is broken etc., when contaminants sticking on a surface of a conductive material are removed using plasma. SOLUTION: A separation groove 11 is formed by selectively etching the conductive foil 10 to form a conductive pattern 21. A circuit element such as a semiconductor element 22A is mounted at a desired place on the conductive pattern 21 and electrically connected to the conductive pattern 21. The conductive foil 10 is irradiated with plasma 33 from above the conductive foil to roughen a surface of the separation groove 11. Eventually, the adhesion strength between sealing resin filling the separation groove 11 and the conductive pattern 21 is improved. COPYRIGHT: (C)2009,JPO&INPIT
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