MECHANICAL ENHANCEMENT OF HIGH-DENSITY POROUS ORGANOSILICATE MATERIAL BY UV EXPOSURE

摘要

PROBLEM TO BE SOLVED: To provide a dielectric material improved so as to have ample mechanical strength, and to provide a method for manufacturing the same. SOLUTION: An organic silicate film having a first material hardness and a first elastic modulus is provided, by depositing the organic silicate film on at least part of a substrate by means of chemical vapor deposition of at least one chemical reaction body that includes a structure-forming agent precursor; and an organic silicate film having a second material hardness and a second elastic modulus is provided, by exposing the organic silicate film to ultraviolet light in a non-oxidizing atmosphere. A dielectric material which is improved in material hardness and elastic modulus is obtained by the method for improving the material hardness and the elastic modulus of an organic silicate film, wherein the second material hardness and the second elastic modulus are at least 10% higher than those of the first material hardness and of the first elastic modulus. COPYRIGHT: (C)2009,JPO&INPIT