发明名称 |
Electrically Connecting Substrate With Electrical Device |
摘要 |
A substrate is electrically connected with an electrical device mounted on the substrate. A ball bond is formed between a first end of a wire and a bonding pad of the substrate. A reverse-motion loop is formed within the wire. A bond is formed between a second end of the wire and a bonding pad of the electrical device.
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申请公布号 |
US2009014850(A1) |
申请公布日期 |
2009.01.15 |
申请号 |
US20080234459 |
申请日期 |
2008.09.19 |
申请人 |
CRAIG DAVID M;CHEN CHIEN-HUA |
发明人 |
CRAIG DAVID M.;CHEN CHIEN-HUA |
分类号 |
H01L23/495;G02B26/00;H01L23/49 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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