发明名称 MANUFACTURING METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
摘要 A probe is contacted to a test pad, without destroying the circuit formed in the chip at the time of a probe test. Therefore, a load jig, a pressing tool, an elastomer, an adhesion ring, and a plunger are made into one by fixation with a nut and a bolt. The elastic force of the spring installed between the spring retaining jig and the load jig acts so that the member used as these one may be depressed toward pad PD. The thrust transmitted from the spring in a plunger to a thin films sheet is used only for the extension of a thin films sheet.
申请公布号 US2009017565(A1) 申请公布日期 2009.01.15
申请号 US20050816369 申请日期 2005.03.11
申请人 HASEBE AKIO;MATSUMOTO HIDEYUKI;YORISAKI SHINGO;MOTOYAMA YASUHIRO;OKAMOTO MASAYOSHI;NARIZUKA YASUNORI;OKAMOTO NAOKI 发明人 HASEBE AKIO;MATSUMOTO HIDEYUKI;YORISAKI SHINGO;MOTOYAMA YASUHIRO;OKAMOTO MASAYOSHI;NARIZUKA YASUNORI;OKAMOTO NAOKI
分类号 H01L21/66 主分类号 H01L21/66
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