FABRICATION OF PLANAR ELECTRONIC CIRCUIT DEVICES

摘要

A method is provided of fabricating a multilayer planar electronic circuit device on a substrate comprising the steps providing a patterned layer of a first conducting material, depositing a layer of a first insulating material and providing a patterned layer of a second conducting material. The method enables the fabrication of complex electronic circuit devices by depositing core material layers and forming the required conducting structures using an imprinting technique. High tolerances are possible at fast processing speed, while keeping processing material costs low.