Multi-layer panel with module sections, for integrated circuits, has external test connections linked to internal test points unconnected to any components

摘要

The panel, to be used for module substrates, has a number of module sections each as a substrate for each module. A circuit (SK) with passive components and switches is integrated in the multi-layer panel within each module section. Contact surfaces on the upper side are fitted with passive or active components, and a connection surface (AF) is on the under side of each module section. At least one test connection (TA) is on the upper or lower side, connected to an inner test point (TP) integrated into the circuit but unconnected to any component. The test points are outside the module surface and section.