| 摘要 |
The prove card is provided to improve the efficiency by using the planarization means for the probe card including the substrate assembly mounting probe. A plurality of probes(401) is arranged in the wafer contact surface of the probe substrate(402) with the regular interval. The probe substrate is positioned in the place which the probe substrate contacts the pad on the wafer which is the test object. In the lower surface, the probe contacting with the pad is mounted. The space transformer(404) is connected to the probe substrate in the lower surface and is connected to the interposer(416) in the upper surface. The combination(406) is mounted in the hole formed in the probe substrate and space transformer.
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