| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a component transfer apparatus comprising image pickup means movable independently to a moving head for recognizing a suction position and also capable of effectively preventing occurrence of a component suction failure resulted from a heat-affected variation of a coordination system of the moving head and the image pickup means. <P>SOLUTION: A component mounting apparatus 1 is comprised of a moving head 4 for transferring a chip component 6 from a component supplying section 5 with the chip component sucked, and a suction position recognizing camera 32 disposed movably independently to the moving head 4 for imaging a suction position of the chip component 6. A control unit of the component mounting apparatus 1 investigates a variation of the coordination system of the moving head 4 and the suction position recognizing camera 32 at a predetermined timing when the coordination system of the moving head 4 and the suction position recognizing camera 32 is estimated to be varied due to the thermal affection to a driving mechanism, and correct a moving amount of the moving head 4 when accessing to the chip component 6 in the component supplying section 5, based on a relationship of the respective coordination systems after the variation. <P>COPYRIGHT: (C)2009,JPO&INPIT |
